Principal TSV Packaging Design Engineer-FEA & Multiphysics

A leading semiconductor company in Idaho City is looking for a Design Engineer to join its TSV Packaging team. This role involves extensive engineering analysis on high-performance memory devices and collaboration with global teams to develop innovative solutions. Candidates should have 8+ years of experience, strong finite element analysis skills, and an advanced degree in Mechanical Engineering. The position also offers a range of comprehensive benefits to support team members' well-being and future planning. #J-18808-Ljbffr