Senior Fellow, SiPh Packaging - Lead Photonic Interconnects

A leading semiconductor foundry is seeking a Senior Fellow to drive the growth of its Photonix platform with advanced packaging solutions. The ideal candidate will have over 20 years of experience in photonic and electronic package architecture, with a proven track record in product development for data centers and automotive. Responsibilities include leading engineering training, maintaining quality standards, and pushing product innovations. This role offers a competitive salary range of $214,200 - $406,500 based on qualifications and experience. #J-18808-Ljbffr