Jobs via Dice
Overview
Senior Package Design Engineer – Lead Package Design Engineer – Technical Link. You will take ownership of package design and layout for our portfolio of connectivity products deployed by the world’s leading cloud service providers and server/networking OEMs. Responsibilities
You will be responsible for driving package substrate design from definition to tape-out, including performance optimization, design for manufacturing, and sign-off verification. You will also guide best practices in APD, review design work for quality and consistency, and work closely with SI/PI, product engineering, and hardware teams to ensure first-pass success. Qualifications
BS/MS in Engineering (Electrical, Mechanical, Materials Science, Physics, or related field). 8+ years of experience in Cadence APD/SiP with a track record of independently designing and releasing FCBGA/FCCSP packages from concept to tape-out. Proven experience leading package design efforts, reviewing and mentoring other designers, and setting technical directions. Deep understanding of BGA substrate technologies, stackups, design rules, and assembly processes. Familiarity with package reliability, SI/PI, and design sign-off methodologies. Entrepreneurial, open-minded, and hands-on work ethic with the ability to drive multiple priorities in a dynamic environment. Strong collaboration and communication skills to work effectively across functions and influence outcomes. Required Experience
Expert proficiency in Cadence APD/SiP (this is a must have). Able to design large-body BGAs from concept through tape-out with minimal guidance. Strong knowledge of package BOM integration, layer stackup, padstacks, constraint setup (physical and electrical), SMT component design, and optimization based on SI/PI feedback. Experience running and interpreting DRC/DRV/LVS/DFM checks, generating documentation, and releasing Gerbers/artwork. Ability to conduct feasibility studies such as fan-out, mock-ups, and layer/package size reduction. Understanding of package manufacturing flow, supply chain considerations, reliability, and risk management. Technical leadership in driving new APD design flows, methodologies, and automation (working with vendors or through scripting).
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Senior Package Design Engineer – Lead Package Design Engineer – Technical Link. You will take ownership of package design and layout for our portfolio of connectivity products deployed by the world’s leading cloud service providers and server/networking OEMs. Responsibilities
You will be responsible for driving package substrate design from definition to tape-out, including performance optimization, design for manufacturing, and sign-off verification. You will also guide best practices in APD, review design work for quality and consistency, and work closely with SI/PI, product engineering, and hardware teams to ensure first-pass success. Qualifications
BS/MS in Engineering (Electrical, Mechanical, Materials Science, Physics, or related field). 8+ years of experience in Cadence APD/SiP with a track record of independently designing and releasing FCBGA/FCCSP packages from concept to tape-out. Proven experience leading package design efforts, reviewing and mentoring other designers, and setting technical directions. Deep understanding of BGA substrate technologies, stackups, design rules, and assembly processes. Familiarity with package reliability, SI/PI, and design sign-off methodologies. Entrepreneurial, open-minded, and hands-on work ethic with the ability to drive multiple priorities in a dynamic environment. Strong collaboration and communication skills to work effectively across functions and influence outcomes. Required Experience
Expert proficiency in Cadence APD/SiP (this is a must have). Able to design large-body BGAs from concept through tape-out with minimal guidance. Strong knowledge of package BOM integration, layer stackup, padstacks, constraint setup (physical and electrical), SMT component design, and optimization based on SI/PI feedback. Experience running and interpreting DRC/DRV/LVS/DFM checks, generating documentation, and releasing Gerbers/artwork. Ability to conduct feasibility studies such as fan-out, mock-ups, and layer/package size reduction. Understanding of package manufacturing flow, supply chain considerations, reliability, and risk management. Technical leadership in driving new APD design flows, methodologies, and automation (working with vendors or through scripting).
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