Packaging Module Engineer: Innovation in Process, Vision & DOE

A leading semiconductor company in Phoenix, Arizona is seeking a passionate individual to develop innovative packaging technologies. The ideal candidate will have a Master's degree or PhD and experience in software development and statistical principles. Responsibilities include optimizing manufacturing processes and collaborating with global teams to ensure quality. Competitive compensation, including stock bonuses, benefits, and a focus on employee development are part of this role. #J-18808-Ljbffr