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Intel Corporation

Packaging Module Engineer: Innovation in Process, Vision & DOE

Intel Corporation, Phoenix, Arizona, United States, 85003

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A leading semiconductor company in Phoenix, Arizona is seeking a passionate individual for a role in semiconductor packaging development. The position requires a Master's or PhD, with expertise in optics and statistical principles. Responsibilities include developing innovative assembly processes, improving manufacturing efficiency, and collaborating with a global team to ensure product quality. This role promises an exciting opportunity to work on groundbreaking technology that impacts lives across the globe. #J-18808-Ljbffr