OVT group
Job Overview
We are seeking a skilled and experienced Hardware Reliability Engineer to support the qualification and production readiness of advanced CMOS Imaging Sensor (CIS) technologies. The ideal candidate will have a strong foundation in semiconductor physics, electronics, and reliability engineering. This role involves close collaboration across cross-functional teams and external foundries to ensure robust product performance and compliance with industry reliability standards.
Key Responsibilities
Design and debug hardware systems for evaluating product reliability under biased conditions. Evaluate and qualify CMOS Imaging Sensor (CIS) products to support mass production readiness. Collaborate with semiconductor foundries to assess, characterize, and optimize CIS manufacturing processes. Partner with R&D, design, process, packaging, and product engineering teams to: Qualify new process technologies. Ensure the reliability and quality of advanced CIS designs meet customer and market expectations. Generate and present internal qualification and evaluation reports. Deliver technical presentations to communicate project outcomes and address product-related issues. Prepare and publish product reliability release documentation. Qualifications & Requirements
BS/MS or PhD in Physics, Electrical Engineering, Materials Science, or equivalent field. 8–15 years of relevant experience , with coursework or knowledge in electronics and semiconductor physics. Proven ability to design reliability test hardware and develop infrastructure for component-level reliability assessments. Basic understanding of CMOS devices and their behavior under various stress conditions. Experience in IC component and packaging reliability qualification is a plus. Familiarity with wafer-level reliability (WLR) testing methodologies is preferred. Knowledge of front-end-of-line (FEOL) and back-end-of-line (BEOL) foundry reliability metrics and tests. Exposure to component engineering concepts and practices is advantageous. Working knowledge of industry reliability standards such as JEDEC and AEC (including automotive-grade reliability). Understanding of IC reliability failure modes, mechanisms, and failure analysis techniques is highly desirable. Strong interpersonal and communication skills, with the ability to work effectively in multicultural, cross-functional teams. Annual base salary for this role in California, US is expected to be between $130,000 - $170,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.
EOE/Minorities/Females/Vet/Disability #J-18808-Ljbffr
We are seeking a skilled and experienced Hardware Reliability Engineer to support the qualification and production readiness of advanced CMOS Imaging Sensor (CIS) technologies. The ideal candidate will have a strong foundation in semiconductor physics, electronics, and reliability engineering. This role involves close collaboration across cross-functional teams and external foundries to ensure robust product performance and compliance with industry reliability standards.
Key Responsibilities
Design and debug hardware systems for evaluating product reliability under biased conditions. Evaluate and qualify CMOS Imaging Sensor (CIS) products to support mass production readiness. Collaborate with semiconductor foundries to assess, characterize, and optimize CIS manufacturing processes. Partner with R&D, design, process, packaging, and product engineering teams to: Qualify new process technologies. Ensure the reliability and quality of advanced CIS designs meet customer and market expectations. Generate and present internal qualification and evaluation reports. Deliver technical presentations to communicate project outcomes and address product-related issues. Prepare and publish product reliability release documentation. Qualifications & Requirements
BS/MS or PhD in Physics, Electrical Engineering, Materials Science, or equivalent field. 8–15 years of relevant experience , with coursework or knowledge in electronics and semiconductor physics. Proven ability to design reliability test hardware and develop infrastructure for component-level reliability assessments. Basic understanding of CMOS devices and their behavior under various stress conditions. Experience in IC component and packaging reliability qualification is a plus. Familiarity with wafer-level reliability (WLR) testing methodologies is preferred. Knowledge of front-end-of-line (FEOL) and back-end-of-line (BEOL) foundry reliability metrics and tests. Exposure to component engineering concepts and practices is advantageous. Working knowledge of industry reliability standards such as JEDEC and AEC (including automotive-grade reliability). Understanding of IC reliability failure modes, mechanisms, and failure analysis techniques is highly desirable. Strong interpersonal and communication skills, with the ability to work effectively in multicultural, cross-functional teams. Annual base salary for this role in California, US is expected to be between $130,000 - $170,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.
EOE/Minorities/Females/Vet/Disability #J-18808-Ljbffr