ASIC Engineer, Physical Design
Meta Platforms - Sunnyvale, California, United States, 94086
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Overview
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Overview
Meta is hiring ASIC Physical Design Engineers within our Infrastructure organization. We are looking for individuals with experience in physical design from RTL to GDSII in low power and high-performance designs to build efficient System on Chip (SoC) and IP for data center applications. Responsibilities
The responsibilities of an ASIC Engineer, Physical Design include: Develop and own physical design implementation of multi-hierarchy SOCs optimized for Perf/W, including physical-aware logic synthesis, floorplan, place and route, clock tree synthesis, static timing analysis, IR drop, EM, and physical verification in advanced technology nodes. Contribute to Architecture decisions for physical design, floorplanning, partitioning, clocking, etc. Work with the Design team to understand partition architecture and drive physical aspects early in the design cycle. Resolve design and flow issues related to the physical design, identify potential solutions, and drive execution. Deliver physical design of an end-to-end IP or integration of ASIC/SoC design and point out lower power and higher performance trade-offs. Interface with the RTL design team to drive design modifications to resolve congestion/timing issues and implement functional ECO's. Use EDA tool-based programming and scripting techniques to automate and develop methodologies to improve throughput and quality. Interact with EDA tool vendors to drive tool fixes and flow improvements. Perform tool evaluations of new vendor tools and functions. Minimum Qualifications
The minimum qualifications for this position include: Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience. 12+ years of experience in interpersonal, teamwork, and demonstrated experience communicating and interfacing with cross-functional teams, IP, and EDA vendors. Experience in physical design and timing closure. Knowledge of RTL2GDSII flow and experience with design tape-outs in 5nm or below process technologies. Experience with EDA tools like DC/Genus, Innovus/ICC2, Primetime, Redhawk/Voltus, or Calibre. Hands-on experience in SoC floor planning, place & route, power and clock distribution, and timing convergence of high-frequency designs. Knowledge of geometry/process/device technology implications on physical design. Experience with large/disaggregated SOC designs (>100M gates) with frequencies over 1GHZ. Programming/scripting skills: TCL, Python, Perl or Shell. Preferred Qualifications
Preferred qualifications for this position include: Experience in full chip floor planning, partitioning, budgeting, and power grid planning. Experience with low power implementation, power gating, multiple voltage rails, UPF/CPF knowledge. Experience in planning, implementing, and analyzing high-speed clock distribution networks. Experience with alternate strategies for clock distribution, including standard trees, mesh, H-Tree, and clock power reduction techniques. Knowledge of static timing analysis and concepts, defining timing constraints and exceptions, corners/voltage definitions. Experience in the physical design of data-path intensive designs. Experience in the 3D-IC technology, methodology, and advanced packaging. Experience in validating Power Distribution Network (PDN), IR/EM, Thermals for 3D-IC.