Rigetti Computing
Senior Process Engineer, Test and Packaging
Rigetti Computing - Fremont, California, us, 94537
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Overview
Senior Process Engineer, Test and Packaging
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Senior Process Engineer, Test and Packaging
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Rigetti Computing . Rigetti Computing is developing full stack quantum computers to solve humanity’s most pressing and valuable problems. We are a highly diverse and interdisciplinary team of engineers and scientists working at the cutting edge of technology in a mission-driven entrepreneurial environment. We believe that bringing together teams from various cultures, educational backgrounds, and technical disciplines helps them see things from more points of view and to make great products that change the world for the better. As the Test & Packaging Engineer, you will work in our state-of-the-art fabrication facility, Fab-1, building superconducting quantum integrated circuits, developing and maintaining wafer/die electrical probing and die packaging equipment and processes. You will be involved in hands-on fabrication and measurement of these devices and collaborate with engineers, technicians, and scientists across process integration, fab production, design, and quantum engineering teams. Key Responsibilities
Wafer/Die/Package Testing: Sustain wafer probe equipment, develop and deploy new test programs, troubleshoot issues related to probe equipment and test procedures, and work with low-level measurement systems. Packaging: Manage assembly and packaging equipment and processes, create packaging diagrams, and specify requirements for assembly tooling and fixtures. Additional Responsibilities
Support development activities, establish process metrics, document processes, guide technicians, monitor failure data, and prepare process requirement documents. About You
Hands-on development and problem solving skills. MS and/or Ph.D. in Science or Engineering preferred. 3-7+ years of experience with semiconductor/MEMS e-test, assembly, and packaging tools. Understanding of semiconductor fabrication and electrical measurement instrumentation; experience with superconducting materials is a plus. Strong communication skills, ability to work independently, and familiarity with SPC, DOE, and cleanroom practices. Salary range: $138,000 - $162,500 annually, with full benefits, equity, and additional perks. Rigetti values diversity and is committed to an inclusive environment. Applications from underrepresented groups are encouraged. About Rigetti
Rigetti is a pioneer in quantum computing, operating quantum computers over the cloud since 2017, designing and manufacturing chips in-house at Fab-1, and serving clients globally. Founded in 2013, it employs over 150 people across the US, UK, and Australia.
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Join to apply for the
Senior Process Engineer, Test and Packaging
role at
Rigetti Computing . Rigetti Computing is developing full stack quantum computers to solve humanity’s most pressing and valuable problems. We are a highly diverse and interdisciplinary team of engineers and scientists working at the cutting edge of technology in a mission-driven entrepreneurial environment. We believe that bringing together teams from various cultures, educational backgrounds, and technical disciplines helps them see things from more points of view and to make great products that change the world for the better. As the Test & Packaging Engineer, you will work in our state-of-the-art fabrication facility, Fab-1, building superconducting quantum integrated circuits, developing and maintaining wafer/die electrical probing and die packaging equipment and processes. You will be involved in hands-on fabrication and measurement of these devices and collaborate with engineers, technicians, and scientists across process integration, fab production, design, and quantum engineering teams. Key Responsibilities
Wafer/Die/Package Testing: Sustain wafer probe equipment, develop and deploy new test programs, troubleshoot issues related to probe equipment and test procedures, and work with low-level measurement systems. Packaging: Manage assembly and packaging equipment and processes, create packaging diagrams, and specify requirements for assembly tooling and fixtures. Additional Responsibilities
Support development activities, establish process metrics, document processes, guide technicians, monitor failure data, and prepare process requirement documents. About You
Hands-on development and problem solving skills. MS and/or Ph.D. in Science or Engineering preferred. 3-7+ years of experience with semiconductor/MEMS e-test, assembly, and packaging tools. Understanding of semiconductor fabrication and electrical measurement instrumentation; experience with superconducting materials is a plus. Strong communication skills, ability to work independently, and familiarity with SPC, DOE, and cleanroom practices. Salary range: $138,000 - $162,500 annually, with full benefits, equity, and additional perks. Rigetti values diversity and is committed to an inclusive environment. Applications from underrepresented groups are encouraged. About Rigetti
Rigetti is a pioneer in quantum computing, operating quantum computers over the cloud since 2017, designing and manufacturing chips in-house at Fab-1, and serving clients globally. Founded in 2013, it employs over 150 people across the US, UK, and Australia.
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