Chip Designer
eTeam - Santa Clara, California, United States, 95050
Work at eTeam
Overview
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Overview
2.5D/3D packaging, flip-chip bonding, TSV, hybrid bonding Semiconductor Processing: BEOL/FEOL integration, advanced interconnects, thin-film deposition (PVD, PECVD, ALD, CVD) Design & Simulation: Siemens NX, Cadence, ANSYS, EasyEDA, ThermoCalc High-Speed I/O & Signal Integrity: Imp...