MACOM
Overview
MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs, and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. MACOM offers foundry services that represents a key core competency within our business. MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.
Position Mechanical Engineering, Principal
Job Description: Support new package design and development by working with a team of engineers and designers. Responsible for all mechanical aspects of new and legacy designs. Devices range from single chip packages to subsystem modules.
Key responsibilities
Ownership of the compliance of designs to meet mechanical requirements
Interaction with customers and ability to negotiate requirements where conflicts may occur
Interaction with internal design engineers, project managers, assembly and test entities to ensure all aspects of the design are in line with expectations across the company
Mechanical analyses including but not limited to structural, thermal and reliability
Ownership and design of assembly and test fixtures
Understanding of machining best practice and GD&T tolerancing
Ability to work with vendors to understand their capabilities in aligning part designs with industry capabilities
Understanding of various manufacturing techniques including subtractive metal fabrication, additive manufacturing, etching, laser cutting, welding and marking
Ability to work in fast paced environment with small and large teams with little-to-no supervision
Qualifications Mechanical Engineering Degree or similar with 8+ years of experience in an electronics packaging role. Experience with IC packaging, system and subsystem mechanical design and analysis. The ideal candidate will have experience with RF and millimeter wave types of products.
Key capabilities of an ideal candidate
Experience with packaging for RF-Power applications, using eutectic and/or sintered epoxy die attach
Experience with aluminum, copper and other alloys for use in packaging and thermal transfer
Understanding and awareness of coefficient of thermal expansion (CTE) matching between various mediums
Understanding of metal plating standards and requirements
Experience in reliability, failure analysis, and quality assurance in advanced package and process development
Experience designing for manufacturing, both internally and externally, both piece-part and assemblies
Knowledge of product characterization, testing, quality and reliability, including compliance testing and certification is a plus [MIL-PRF-38534, JEDEC, IPC, etc.]
Intimate knowledge of structural analysis using 3D CAD tools as well as first principles
Intimate knowledge of thermal analysis using 3D CAD tools as well as first principles
Demonstrated ability to lead independent process development
Ability to provide suppliers direction by working with design, assembly, and quality organizations
Familiar with finite element analyses (FEA) and computational fluid dynamics (CFD) desired
Familiar solving steady state and dynamic thermal problems
Experience using: SolidWorks, AutoCAD, and PCB layout viewers is ideal
Strong problem solving skills along with good communication, teamwork, and interpersonal skills
Experience in critical thinking and presentation skills
Experience with supplier and program management roles
Experience working in complex teams to understand and balance all aspects of a design to meet desired outcomes
Ability to balance and prioritize multiple programs and needs simultaneously
Fluent communicator in the English language
Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.
EEO & Accommodation EEO:
MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.
Reasonable Accommodation:
MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process please call +1-978-656-2500 or email HR_Ops@MACOM.com. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.
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Position Mechanical Engineering, Principal
Job Description: Support new package design and development by working with a team of engineers and designers. Responsible for all mechanical aspects of new and legacy designs. Devices range from single chip packages to subsystem modules.
Key responsibilities
Ownership of the compliance of designs to meet mechanical requirements
Interaction with customers and ability to negotiate requirements where conflicts may occur
Interaction with internal design engineers, project managers, assembly and test entities to ensure all aspects of the design are in line with expectations across the company
Mechanical analyses including but not limited to structural, thermal and reliability
Ownership and design of assembly and test fixtures
Understanding of machining best practice and GD&T tolerancing
Ability to work with vendors to understand their capabilities in aligning part designs with industry capabilities
Understanding of various manufacturing techniques including subtractive metal fabrication, additive manufacturing, etching, laser cutting, welding and marking
Ability to work in fast paced environment with small and large teams with little-to-no supervision
Qualifications Mechanical Engineering Degree or similar with 8+ years of experience in an electronics packaging role. Experience with IC packaging, system and subsystem mechanical design and analysis. The ideal candidate will have experience with RF and millimeter wave types of products.
Key capabilities of an ideal candidate
Experience with packaging for RF-Power applications, using eutectic and/or sintered epoxy die attach
Experience with aluminum, copper and other alloys for use in packaging and thermal transfer
Understanding and awareness of coefficient of thermal expansion (CTE) matching between various mediums
Understanding of metal plating standards and requirements
Experience in reliability, failure analysis, and quality assurance in advanced package and process development
Experience designing for manufacturing, both internally and externally, both piece-part and assemblies
Knowledge of product characterization, testing, quality and reliability, including compliance testing and certification is a plus [MIL-PRF-38534, JEDEC, IPC, etc.]
Intimate knowledge of structural analysis using 3D CAD tools as well as first principles
Intimate knowledge of thermal analysis using 3D CAD tools as well as first principles
Demonstrated ability to lead independent process development
Ability to provide suppliers direction by working with design, assembly, and quality organizations
Familiar with finite element analyses (FEA) and computational fluid dynamics (CFD) desired
Familiar solving steady state and dynamic thermal problems
Experience using: SolidWorks, AutoCAD, and PCB layout viewers is ideal
Strong problem solving skills along with good communication, teamwork, and interpersonal skills
Experience in critical thinking and presentation skills
Experience with supplier and program management roles
Experience working in complex teams to understand and balance all aspects of a design to meet desired outcomes
Ability to balance and prioritize multiple programs and needs simultaneously
Fluent communicator in the English language
Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.
EEO & Accommodation EEO:
MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.
Reasonable Accommodation:
MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process please call +1-978-656-2500 or email HR_Ops@MACOM.com. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.
#J-18808-Ljbffr