Insight Global
This range is provided by Insight Global. Your actual pay will be based on your skills and experience — talk with your recruiter to learn more.
Base pay range
$180,000.00/yr - $205,000.00/yr Job Description
We are looking for an Optoelectronics Packaging Design Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, manufacturing, systems, IC and operations to drive our packaging development. The role is San Francisco based and will include some travel. Responsibilities include: Lead the design, simulation, and development of high-performance IC package designs and chip carriers to meet product and qualification requirements. Work closely with across hardware engineering disciplines to design best-in-class package assemblies for advanced laser and opto-electronic ASIC chips operating in harsh environments. Work closely with the manufacturing engineering and quality teams to ensure a seamless transition from prototype to high-volume production. Define and execute test plans for package/system level reliability. Conduct failure analysis to drive continuous improvement. Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components. Requirements
Required Skills & Experience: 5+ years in Semiconductor Package/Process Development or 2+ years with a relevant master's degree. Proficiency in 3D CAD (e.g., SolidWorks) and FEA simulation tools (e.g., ANSYS). Hands-on experience with automated high-accuracy die bonding, wirebonding, and active optical alignment systems. Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates. Experience with optical systems (LiDar, Camera, Microscope, etc). Nice to Have Skills & Experience: Bachelor's and/or Master's degree in Materials Science, electrical engineering, mechanical engineering, or related field. Experience with ATE package test environment. Experience with statistical analysis for volume production processes. Experience in automated micro electronic and photonic assembly processes. AEC-Q100 or related automotive qualification experience. We are an equal opportunities employer and welcome applications from all qualified candidates.
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$180,000.00/yr - $205,000.00/yr Job Description
We are looking for an Optoelectronics Packaging Design Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, manufacturing, systems, IC and operations to drive our packaging development. The role is San Francisco based and will include some travel. Responsibilities include: Lead the design, simulation, and development of high-performance IC package designs and chip carriers to meet product and qualification requirements. Work closely with across hardware engineering disciplines to design best-in-class package assemblies for advanced laser and opto-electronic ASIC chips operating in harsh environments. Work closely with the manufacturing engineering and quality teams to ensure a seamless transition from prototype to high-volume production. Define and execute test plans for package/system level reliability. Conduct failure analysis to drive continuous improvement. Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components. Requirements
Required Skills & Experience: 5+ years in Semiconductor Package/Process Development or 2+ years with a relevant master's degree. Proficiency in 3D CAD (e.g., SolidWorks) and FEA simulation tools (e.g., ANSYS). Hands-on experience with automated high-accuracy die bonding, wirebonding, and active optical alignment systems. Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates. Experience with optical systems (LiDar, Camera, Microscope, etc). Nice to Have Skills & Experience: Bachelor's and/or Master's degree in Materials Science, electrical engineering, mechanical engineering, or related field. Experience with ATE package test environment. Experience with statistical analysis for volume production processes. Experience in automated micro electronic and photonic assembly processes. AEC-Q100 or related automotive qualification experience. We are an equal opportunities employer and welcome applications from all qualified candidates.
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