NanoHelp
HBM Design Architect – Micron Technology, Richardson, TX (USA)
NanoHelp, Richardson, Texas, United States, 75080
Shaping the Future of High-Bandwidth Memory through Nanotechnology Innovation
Micron Technology seeks a highly skilled
HBM Design Architect
to lead the design, architecture, and integration of advanced DRAM technologies. This role focuses on
nanometer-scale DRAM array architectures ,
high-speed signaling , and
2.5D/3D packaging
innovations, enabling next-generation AI, HPC, and data-intensive systems. Role Summary The
HBM Design Architect
at Micron Technology will be at the forefront of
nanometer-scale memory innovation , shaping
next-generation High Bandwidth Memory (HBM)
for AI, HPC, and advanced semiconductor systems. You will combine expertise in
DRAM array design ,
high-speed interface development , and
advanced 2.5D/3D packaging
to deliver cutting-edge memory solutions with optimal
performance, power efficiency, and reliability . Key Responsibilities
Lead architecture pathfinding and feasibility analysis for new HBM generations. Collaborate with customers to refine specifications and future designs. Debug pre- and post-silicon HBM issues and identify root causes. Innovate in
nanotechnology-driven DRAM arrays ,
signal integrity , and
thermal modeling . Work with
JEDEC standards , CAD, verification, and system engineering teams. Mentor engineers in advanced DRAM and packaging techniques. Required Qualifications
Education:
BSEE or higher (nanotechnology, electrical engineering, semiconductor engineering). Experience:
10+ years in engineering/design; strong background in
nanometer CMOS ,
DRAM architecture , and
3D integration . Expertise in one or more: Memory array design High-speed clocking/interfaces 2.5D/3D packaging (TSV, hybrid bonding, interposers) Strong understanding of
semiconductor device physics . Familiarity with
DRAM bring-up, JEDEC standards , and modeling tools (FastSpice, Hspice). Micron offers a
collaborative, innovation-driven environment , solving real-world challenges in
nano-enabled semiconductor technologies . Benefits include: Comprehensive medical, dental, and vision coverage Paid time off and family leave Income protection and holidays Opportunities for professional growth in nanotechnology and semiconductor design Micron Technology is an equal opportunities employer and welcomes applications from all qualified candidates.
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Micron Technology seeks a highly skilled
HBM Design Architect
to lead the design, architecture, and integration of advanced DRAM technologies. This role focuses on
nanometer-scale DRAM array architectures ,
high-speed signaling , and
2.5D/3D packaging
innovations, enabling next-generation AI, HPC, and data-intensive systems. Role Summary The
HBM Design Architect
at Micron Technology will be at the forefront of
nanometer-scale memory innovation , shaping
next-generation High Bandwidth Memory (HBM)
for AI, HPC, and advanced semiconductor systems. You will combine expertise in
DRAM array design ,
high-speed interface development , and
advanced 2.5D/3D packaging
to deliver cutting-edge memory solutions with optimal
performance, power efficiency, and reliability . Key Responsibilities
Lead architecture pathfinding and feasibility analysis for new HBM generations. Collaborate with customers to refine specifications and future designs. Debug pre- and post-silicon HBM issues and identify root causes. Innovate in
nanotechnology-driven DRAM arrays ,
signal integrity , and
thermal modeling . Work with
JEDEC standards , CAD, verification, and system engineering teams. Mentor engineers in advanced DRAM and packaging techniques. Required Qualifications
Education:
BSEE or higher (nanotechnology, electrical engineering, semiconductor engineering). Experience:
10+ years in engineering/design; strong background in
nanometer CMOS ,
DRAM architecture , and
3D integration . Expertise in one or more: Memory array design High-speed clocking/interfaces 2.5D/3D packaging (TSV, hybrid bonding, interposers) Strong understanding of
semiconductor device physics . Familiarity with
DRAM bring-up, JEDEC standards , and modeling tools (FastSpice, Hspice). Micron offers a
collaborative, innovation-driven environment , solving real-world challenges in
nano-enabled semiconductor technologies . Benefits include: Comprehensive medical, dental, and vision coverage Paid time off and family leave Income protection and holidays Opportunities for professional growth in nanotechnology and semiconductor design Micron Technology is an equal opportunities employer and welcomes applications from all qualified candidates.
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