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DMTS Process Integration Engineer – Advanced Packaging | Micron, Boise
NanoHelp, Boise, Idaho, United States, 83708
DMTS Process Integration Engineer – Advanced Packaging | Micron, Boise
Micron Boise is hiring a Process Integration Engineer to lead integration strategies for advanced memory packaging. Shape 3DIC, hybrid bonding, and FO-WLP innovations in next-gen nanotechnology. Job Details Title : DMTS Process Integration Engineer – Advanced Package Technology Development (APTD) Organization : Micron Technology, Inc. Work Location : Boise, Idaho, USA Research Field : Nanotechnology, Electronics, Materials Engineering, Electrical Engineering, Mechanical Engineering Funding Info : Industry-funded (Micron) Application Deadline : Rolling Posted Date : July 2025 Country : United States Required Qualification : MS or PhD in Engineering, Physics, Chemistry, or related fields Required Experience : Experience in DRAM/NAND/3DIC, hybrid bonding, integration, and yield optimization Salary Details : Competitive with US-based benefits Key Responsibilities
Lead process integration efforts in 3DIC, hybrid bonding, FO-WLP, and other packaging innovations Develop line monitoring methods, yield improvement plans, and statistical process controls Design and analyze experiments (DoEs) using advanced analytics and system tools Drive cross-site project coordination, communication, and technology transfer Mentor early-career engineers, lead KT problem-solving, and contribute to training sessions Define contingency plans, build integration flows, and align direction with global teams Present findings across teams and publish ECN and change documentation Translate design goals into process innovation across integration domains Required Qualifications
MS or PhD in Electrical, Mechanical, Materials, Computer Engineering, Physics, or Chemistry Strong background in Advanced Packaging, DRAM, NAND, 3DIC, hybrid bonding, or FO-WLP Proficiency in data analysis, JMP/system tools, and process diagnostics Leadership and communication skills across cross-functional R&D and manufacturing teams Adaptability in dynamic, high-tech environments Micron offers a collaborative, innovation-first culture with robust benefits including healthcare plans, paid time off, global learning opportunities, and long-term career development. Micron is an equal opportunity employer and does not charge candidates any fees. AI-assisted resumes are welcome but must reflect accurate experience. Misrepresentation may lead to disqualification. All applications are subject to Micron’s equal opportunity and labor compliance policies.
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Micron Boise is hiring a Process Integration Engineer to lead integration strategies for advanced memory packaging. Shape 3DIC, hybrid bonding, and FO-WLP innovations in next-gen nanotechnology. Job Details Title : DMTS Process Integration Engineer – Advanced Package Technology Development (APTD) Organization : Micron Technology, Inc. Work Location : Boise, Idaho, USA Research Field : Nanotechnology, Electronics, Materials Engineering, Electrical Engineering, Mechanical Engineering Funding Info : Industry-funded (Micron) Application Deadline : Rolling Posted Date : July 2025 Country : United States Required Qualification : MS or PhD in Engineering, Physics, Chemistry, or related fields Required Experience : Experience in DRAM/NAND/3DIC, hybrid bonding, integration, and yield optimization Salary Details : Competitive with US-based benefits Key Responsibilities
Lead process integration efforts in 3DIC, hybrid bonding, FO-WLP, and other packaging innovations Develop line monitoring methods, yield improvement plans, and statistical process controls Design and analyze experiments (DoEs) using advanced analytics and system tools Drive cross-site project coordination, communication, and technology transfer Mentor early-career engineers, lead KT problem-solving, and contribute to training sessions Define contingency plans, build integration flows, and align direction with global teams Present findings across teams and publish ECN and change documentation Translate design goals into process innovation across integration domains Required Qualifications
MS or PhD in Electrical, Mechanical, Materials, Computer Engineering, Physics, or Chemistry Strong background in Advanced Packaging, DRAM, NAND, 3DIC, hybrid bonding, or FO-WLP Proficiency in data analysis, JMP/system tools, and process diagnostics Leadership and communication skills across cross-functional R&D and manufacturing teams Adaptability in dynamic, high-tech environments Micron offers a collaborative, innovation-first culture with robust benefits including healthcare plans, paid time off, global learning opportunities, and long-term career development. Micron is an equal opportunity employer and does not charge candidates any fees. AI-assisted resumes are welcome but must reflect accurate experience. Misrepresentation may lead to disqualification. All applications are subject to Micron’s equal opportunity and labor compliance policies.
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