Hemlock Semiconductor
Process Design, Engineering Discipline Leader
Hemlock Semiconductor, Hemlock, Michigan, United States, 48626
Overview
Join to apply for the
Process Design, Engineering Discipline Leader
role at
Hemlock Semiconductor . At Hemlock Semiconductor (HSC), we transform people’s lives by energizing and connecting our world through silicon technology. Since 1961, HSC has been a leading global provider of hyper-pure polysilicon, and is the only polysilicon manufacturer headquartered in the United States. HSC plays an essential role in the semiconductor and solar industries, with the vision of becoming the preferred supplier of silicon-enabled technologies to the low-carbon, digital world. Our polysilicon is used to make computer chips – the “brains” behind the electronic devices we rely on to make our lives easier, safer and more enjoyable. HSC is just one of six major manufacturers in the world that makes polysilicon used to create semiconductor wafers. In fact, nearly all electronic devices in the world contain HSC polysilicon. We’re also moving the world toward a greener future by supplying the rapidly growing solar power industry. HSC is committed to doing good for our local Michigan and global communities, relentlessly improving our operations to remove supply chain carbon emissions. The low embodied greenhouse gas emissions in our polysilicon materials facilitates the production of ultra low-carbon solar panels. These panels allow solar project developers and owners to lower the embodied carbon of their projects by up to 50 percent. To achieve our goals, we draw on the talents of more than 1,500 employees and contractors. Our employees thrive in a culture that values teamwork, excellence, responsibility and customer focus. We recognize and value the diverse backgrounds and experiences of all of our people working together as One Team. At HSC, you belong to a team that is transforming our world. Responsibilities
Process Design Responsibilities
– Develop detailed project charters and scope through sponsor interviews; identify, evaluate, and recommend alternatives for technology, cost, and operability; coordinate cost estimation for projects prior to project team kick-off; coordinate economic assessment for growth and cost savings projects; develop and maintain process design toolkit; execute relief valve calculations and file updates; apply ASPEN simulation tools and design, sizing, and specification of equipment; develop P&IDs and PFDs; identify and apply all applicable internal and external standards, codes, and regulations; execute all required process hazard assessments to ensure safety in designs. Essential Functions Cont.
– Facilitation of the assembly of the process design package at the completion of front-end definition as required by the Project Manager and/or Capital Engineering Manager (strongly recommended for projects with capital investment >$2M). Discipline Leader Responsibilities
– Complete items for successful project execution communicating scope, cost and schedule; participate in goal setting and performance process with direct supervisor; provide feedback on discipline engineers; be a member of site NWGs and regulatory committees; organize training for the team; create and maintain team atmosphere with effective communication; maintain site engineering documentation systems including record prints, engineering drawings, SAP maintenance system data, and site P&ID drawing management; own discipline HSC SSGs; provide technical expertise and personal responsibility to complete and sign off on tasks on the MOC form; report to Project leaders on all relevant project activities; time confirmation entry in SAP; monthly updating of resource management tools. Additional Duties/Responsibilities
– Develop, update, and/or prompt generation of process information for each project (PFD, P&ID, PPTA, Equipment Datasheets, Process Conditions Datasheets, Process Design Equipment Record Forms, Process Hazard Analysis, CETs, LOPA, Over-pressure Protection, Process Overview Narrative); complete work orders as directed; support development and maintenance of process design NWG; maintain HSC process design SSGs to reflect industry best practices and internal requirements. Qualifications
Minimum Education
– B.S. in Chemical Engineering (required). Minimum Work Experience
– Minimum seven (7) years’ experience in manufacturing operations and an engineering environment. Skills
– Influential management, strong oral, written, and interpersonal communication, SME discipline expertise, project planning and execution knowledge, ability to work independently or in multi-discipline teams, ability to interact with all levels of the organization and external vendors, proven skills with ASPEN or equivalent process simulation software. Compensation and Benefits
The range for this position is $125,000 - $155,000 assuming full time status. Starting pay is dependent on factors including market demands, experience, training, and education. Benefits may include medical, dental, vision, 401(k), variable bonus, life insurance, disability benefits, and PTO, depending on hours worked. EEO Notice
HSC is an equal employment opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, age, protected veteran status, disability, marital status, pregnancy, sexual orientation, ancestry, genetic information, or any other characteristic protected by law. Application Assistance
If you are an individual with a disability and need an accommodation or other assistance during the application process, please call our Human Resources Department at 989.301.5333 or email G1HSC-HR@hscpoly.com. All qualified applicants are encouraged to apply.
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Join to apply for the
Process Design, Engineering Discipline Leader
role at
Hemlock Semiconductor . At Hemlock Semiconductor (HSC), we transform people’s lives by energizing and connecting our world through silicon technology. Since 1961, HSC has been a leading global provider of hyper-pure polysilicon, and is the only polysilicon manufacturer headquartered in the United States. HSC plays an essential role in the semiconductor and solar industries, with the vision of becoming the preferred supplier of silicon-enabled technologies to the low-carbon, digital world. Our polysilicon is used to make computer chips – the “brains” behind the electronic devices we rely on to make our lives easier, safer and more enjoyable. HSC is just one of six major manufacturers in the world that makes polysilicon used to create semiconductor wafers. In fact, nearly all electronic devices in the world contain HSC polysilicon. We’re also moving the world toward a greener future by supplying the rapidly growing solar power industry. HSC is committed to doing good for our local Michigan and global communities, relentlessly improving our operations to remove supply chain carbon emissions. The low embodied greenhouse gas emissions in our polysilicon materials facilitates the production of ultra low-carbon solar panels. These panels allow solar project developers and owners to lower the embodied carbon of their projects by up to 50 percent. To achieve our goals, we draw on the talents of more than 1,500 employees and contractors. Our employees thrive in a culture that values teamwork, excellence, responsibility and customer focus. We recognize and value the diverse backgrounds and experiences of all of our people working together as One Team. At HSC, you belong to a team that is transforming our world. Responsibilities
Process Design Responsibilities
– Develop detailed project charters and scope through sponsor interviews; identify, evaluate, and recommend alternatives for technology, cost, and operability; coordinate cost estimation for projects prior to project team kick-off; coordinate economic assessment for growth and cost savings projects; develop and maintain process design toolkit; execute relief valve calculations and file updates; apply ASPEN simulation tools and design, sizing, and specification of equipment; develop P&IDs and PFDs; identify and apply all applicable internal and external standards, codes, and regulations; execute all required process hazard assessments to ensure safety in designs. Essential Functions Cont.
– Facilitation of the assembly of the process design package at the completion of front-end definition as required by the Project Manager and/or Capital Engineering Manager (strongly recommended for projects with capital investment >$2M). Discipline Leader Responsibilities
– Complete items for successful project execution communicating scope, cost and schedule; participate in goal setting and performance process with direct supervisor; provide feedback on discipline engineers; be a member of site NWGs and regulatory committees; organize training for the team; create and maintain team atmosphere with effective communication; maintain site engineering documentation systems including record prints, engineering drawings, SAP maintenance system data, and site P&ID drawing management; own discipline HSC SSGs; provide technical expertise and personal responsibility to complete and sign off on tasks on the MOC form; report to Project leaders on all relevant project activities; time confirmation entry in SAP; monthly updating of resource management tools. Additional Duties/Responsibilities
– Develop, update, and/or prompt generation of process information for each project (PFD, P&ID, PPTA, Equipment Datasheets, Process Conditions Datasheets, Process Design Equipment Record Forms, Process Hazard Analysis, CETs, LOPA, Over-pressure Protection, Process Overview Narrative); complete work orders as directed; support development and maintenance of process design NWG; maintain HSC process design SSGs to reflect industry best practices and internal requirements. Qualifications
Minimum Education
– B.S. in Chemical Engineering (required). Minimum Work Experience
– Minimum seven (7) years’ experience in manufacturing operations and an engineering environment. Skills
– Influential management, strong oral, written, and interpersonal communication, SME discipline expertise, project planning and execution knowledge, ability to work independently or in multi-discipline teams, ability to interact with all levels of the organization and external vendors, proven skills with ASPEN or equivalent process simulation software. Compensation and Benefits
The range for this position is $125,000 - $155,000 assuming full time status. Starting pay is dependent on factors including market demands, experience, training, and education. Benefits may include medical, dental, vision, 401(k), variable bonus, life insurance, disability benefits, and PTO, depending on hours worked. EEO Notice
HSC is an equal employment opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, age, protected veteran status, disability, marital status, pregnancy, sexual orientation, ancestry, genetic information, or any other characteristic protected by law. Application Assistance
If you are an individual with a disability and need an accommodation or other assistance during the application process, please call our Human Resources Department at 989.301.5333 or email G1HSC-HR@hscpoly.com. All qualified applicants are encouraged to apply.
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