Theron Solutions
Principal Application Engineer - Semiconductor Advanced Package
Theron Solutions, Irvine, California, United States, 92713
Principal Application Engineer – Semiconductor Advanced Package
Overview of the role and core responsibilities for a Principal Application Engineer in semiconductor advanced packaging.
Key Responsibilities
Lead technical support for developmental and commercialized products
Optimize material application processes and solve process-related challenges
Provide direct customer support and ensure successful product implementation
Develop in-depth application knowledge for electronics packaging markets
Solve complex, product-line-level issues through novel process development and material characterization
Required Skills & Experience
10+ years in semiconductor packaging materials, ideally in a chemical company
Strong background in liquid compression molding, wafer-level encapsulation, and molding processes
Familiarity with 2.5D and 3D packaging trends
Excellent verbal communication and interpersonal skills
Strong ownership, customer orientation, and project/time management
Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field
Qualifications Minimum of a bachelor’s degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or related fields, with 10+ years of experience in a chemical for semiconductor advanced packaging environment.
Equal Opportunity Our client is an Equal Opportunity Employer, committed to a workplace free from discrimination and harassment. Employment decisions are based on business needs, job requirements, and individual qualifications without regard to race, color, religion, gender, age, disability, sexual orientation, gender identity, marital status, military service, genetic information, or any other status protected by law.
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Key Responsibilities
Lead technical support for developmental and commercialized products
Optimize material application processes and solve process-related challenges
Provide direct customer support and ensure successful product implementation
Develop in-depth application knowledge for electronics packaging markets
Solve complex, product-line-level issues through novel process development and material characterization
Required Skills & Experience
10+ years in semiconductor packaging materials, ideally in a chemical company
Strong background in liquid compression molding, wafer-level encapsulation, and molding processes
Familiarity with 2.5D and 3D packaging trends
Excellent verbal communication and interpersonal skills
Strong ownership, customer orientation, and project/time management
Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field
Qualifications Minimum of a bachelor’s degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or related fields, with 10+ years of experience in a chemical for semiconductor advanced packaging environment.
Equal Opportunity Our client is an Equal Opportunity Employer, committed to a workplace free from discrimination and harassment. Employment decisions are based on business needs, job requirements, and individual qualifications without regard to race, color, religion, gender, age, disability, sexual orientation, gender identity, marital status, military service, genetic information, or any other status protected by law.
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