Package Layout Designer (Substrate)

Piper Companies is hiring a Package Layout Designer (Substrate) for a small start up based in Saratoga, CA. The Package Layout Designer (Substrate) will be driving the entirety of the layout to come up with a conclusion for this packaging and design the physical layout for package substrate technology. The Package Layout Designer (Substrate) will need to sit on site 5 days per week in Saratoga, CA and this is a 4-6 month contract opportunity with potential to extend.

Responsibilities for the Package Layout Designer (Substrate):

Drive high-density substrate designs for advanced multi-die packages

Plan bump maps, escape routes, vias, and layer stack-ups

Work with ASIC, Signal, Power Teams to make sure the escape routes and breakouts from the silicon package is okay

Assess routing feasibility with respect to die layout and mechanical constraints

Align floor planning with system, packaging, and mechanical teams

Optimize signal, power, and ground integrity through smart routing

Perform DRC, DFM, and manufacturing rule checks

Finalize design packages and coordinate with substrate vendors

Support layout reviews and incorporate stakeholder feedback

Requirements for the Package Layout Designer (Substrate):

6+ Years of experience designing the physical layout design for package substrate technology

Expertise in layout design work

Experience working with ASIC, Signal and Power Teams

Advance Knowledge in Allegro Cadence APD, Siemens (Xpedition) and AutoCAD design tools

Compensation for the Package Layout Designer (Substrate):

$140,000 - $165,000 at an hourly rate

Full Comprehensive Benefits: Health, Vision, Dental, PTO, Paid Holiday, Sick Leave if Required by law

Keywords: substrate design, multi-die packages, bump mapping, escape routing, via structures, layer stack-up, routing feasibility, die floorplanning, IO bump placement, mechanical constraints, floor planning, system architecture, packaging collaboration, mechanical integration, signal integrity, power integrity, ground integrity, design constraints, DRC, DFM, manufacturing checks, fabrication readiness, final design packages, vendor coordination, layout reviews, stakeholder feedback

#ONSITE

#LI-AG1

This job opens for applications on 11/5/2025. Applications for this job will be accepted for at least 30 days from the posting date.

#J-18808-Ljbffr