Draper
A leading nonprofit research firm in Cambridge is seeking a Senior Bond Process Engineer with manual wafer processing expertise. The ideal candidate should have 5–10 years of experience in Microsystems Engineering and a Bachelor’s degree in a relevant field. Responsibilities include developing bonding processes, designing MEMS devices, and mentoring junior engineers. This full-time role offers a competitive salary range of $82,300.00 to $205,750.00 and requires obtaining a government security clearance.
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