Senior MEMS Bonding Engineer — Hands-On, Defense/Aerospace

A nonprofit research and development company in Cambridge, MA, is seeking a Bond Process Engineer to join their MEMS Tools & Logistics team. The ideal candidate will have extensive experience in manual wafer processing and bond process development. Responsibilities include designing MEMS devices, performing tests, and mentoring junior engineers. Applicants should possess a Bachelor's degree in a relevant field and have 5-10 years of related experience. This position offers a competitive salary range of $82,300.00 - $205,750.00. #J-18808-Ljbffr