MEMS Bond Process Engineer - Manual Wafer Bonding Expert

A nonprofit research and development company in Cambridge is seeking a Bond Process Engineer to join their MEMS Tools & Logistics team. This hands-on role involves developing and refining bonding processes for defense applications, requiring expertise in various bond types. Candidates should have a Bachelor's degree in a related field and 5-10 years of experience in Microsystems Engineering. The position offers a salary range of $82,300 to $205,750, with a focus on work-life balance and inclusivity. #J-18808-Ljbffr