Senior MEMS Bonding Engineer — Hands-On, Defense/Aerospace

An innovative R&D firm in Cambridge, MA is seeking a Bond Process Engineer to specialize in manual wafer processing within defense and aerospace applications. The role involves developing bonding processes and mentoring less experienced engineers. Candidates should have expertise in various bond types and experience in process improvements. A Bachelor's degree and 5-10 years of relevant experience are required. #J-18808-Ljbffr