MediaTek
Base Pay Range
$190,000.00/yr - $270,000.00/yr
Job Description
- Collaborate with product architects during the early definition stage to understand and define package architectures and roadmaps.
- Design optical structures for silicon photonics products, focusing on thermal management, optoelectronic conversion, and packaging process integration.
- Partner with the design team and external vendors to develop package and thermal solutions, including FAU and supporting mechanical components and thermal, to meet product requirements.
- Support the prototype fabrication of silicon photonic optical engines, ensuring performance aligns with design and quality standards.
Requirements
- Master’s or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
- Experience in developing and deploying silicon photonics solutions to the market.
- Experience in developing and deploying thermal solutions for silicon photonics to the market.
- Over 5 years of experience collaborating with manufacturing partners, including suppliers, OSATs, and foundries.
- In-depth knowledge of various thermal solutions, packaging architectures, such as 3D die stacking, 2.5D CoWoS, and fan-out packaging.
Seniority Level
Not Applicable
Employment Type
Full-time
Job Function
Product Management and Marketing
Industries
Computer Hardware Manufacturing, Semiconductor Manufacturing, and Wireless Services
#J-18808-Ljbffr