Piper Companies
Advanced Packaging Engineer - High-Performance Systems Integratio...
Piper Companies - Saratoga, California, us, 95071
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Overview
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Overview
We are seeking a highly experienced
Advanced Packaging Engineer
with deep expertise in substrate layout, system integration, and packaging technologies. This is a high-impact, on-site role focused on advanced organic substrate layout, routing feasibility, and co-design alignment across floorplanning, mechanical, and system-level constraints. You'll be part of a small, expert team shaping the physical implementation of a first-of-its-kind high-performance package. This position is a hybrid role located in
Saratoga, California.
Responsibilities of the Advanced Packaging Engineer:
Drive initiatives for advanced packaging technologies, including substrate layout and system-level integration Collaborate closely with TSMC in Taiwan and local engineering teams to develop and implement packaging solutions Lead co-design efforts across electrical, mechanical, and thermal domains to ensure alignment with system-level constraints Evaluate and optimize routing feasibility and substrate design for high-performance applications Integrate advanced packaging technologies such as CoWoS into system architectures Support cross-functional teams in the development of 2.5D/3D stacking and heterogeneous integration solutions Qualifications of the Advanced Packaging Engineer:
15+ years of experience in advanced packaging technology development and system integration Proven ability to wear multiple hats and lead cross-functional initiatives across global teams Deep understanding of CoWoS technology and its application in high-performance systems Strong system-level background with experience integrating packages into full systems Knowledge of 3D stacking and heterogeneous integration (preferred) Bachelor's degree in Mechanical Engineering, Electrical Engineering, or related field Background in Materials Science is helpful; Master's degree is a plus Compensation of the Advanced Packaging Engineer:
Salary Range: $190,000 - $270,000, based on experience Location: On-site (U.S. based) Benefits: Medical, Dental, Vision, 401K, PTO, parental leave, and sick leave as required by law Application Details:
Job opens for applications on: 07/02 Applications will be accepted for at least 30 days from the posting date
Keywords:
Advanced Packaging, CoWoS, Substrate Layout, System Integration, TSMC, 3D Stacking, Organic Substrate, High-Performance Computing, Mechanical Engineering, Electrical Engineering, Materials Science, Floorplanning, Routing Feasibility, Heterogeneous Integration
#LI-KI1 #LI-HYBRID
Advanced Packaging Engineer
with deep expertise in substrate layout, system integration, and packaging technologies. This is a high-impact, on-site role focused on advanced organic substrate layout, routing feasibility, and co-design alignment across floorplanning, mechanical, and system-level constraints. You'll be part of a small, expert team shaping the physical implementation of a first-of-its-kind high-performance package. This position is a hybrid role located in
Saratoga, California.
Responsibilities of the Advanced Packaging Engineer:
Drive initiatives for advanced packaging technologies, including substrate layout and system-level integration Collaborate closely with TSMC in Taiwan and local engineering teams to develop and implement packaging solutions Lead co-design efforts across electrical, mechanical, and thermal domains to ensure alignment with system-level constraints Evaluate and optimize routing feasibility and substrate design for high-performance applications Integrate advanced packaging technologies such as CoWoS into system architectures Support cross-functional teams in the development of 2.5D/3D stacking and heterogeneous integration solutions Qualifications of the Advanced Packaging Engineer:
15+ years of experience in advanced packaging technology development and system integration Proven ability to wear multiple hats and lead cross-functional initiatives across global teams Deep understanding of CoWoS technology and its application in high-performance systems Strong system-level background with experience integrating packages into full systems Knowledge of 3D stacking and heterogeneous integration (preferred) Bachelor's degree in Mechanical Engineering, Electrical Engineering, or related field Background in Materials Science is helpful; Master's degree is a plus Compensation of the Advanced Packaging Engineer:
Salary Range: $190,000 - $270,000, based on experience Location: On-site (U.S. based) Benefits: Medical, Dental, Vision, 401K, PTO, parental leave, and sick leave as required by law Application Details:
Job opens for applications on: 07/02 Applications will be accepted for at least 30 days from the posting date
Keywords:
Advanced Packaging, CoWoS, Substrate Layout, System Integration, TSMC, 3D Stacking, Organic Substrate, High-Performance Computing, Mechanical Engineering, Electrical Engineering, Materials Science, Floorplanning, Routing Feasibility, Heterogeneous Integration
#LI-KI1 #LI-HYBRID